Apparatus for wiring connections on a substrate

摘要

The surface of a substrate, particularly a multi-layer substrate, is wired by an apparatus including a tool carrier and a substrate carrier. The substrate carrier is positioned in a substantially horizontal plane so it is situated opposite the tool carrier. The substrate carrier is displaced relative to the tool carrier in the horizontal plane, i.e., relative to the vertical plane. A heating element and an electric wire dispenser are carried by the tool carrier. The dispenser includes a wire outlet orifice situated close to an end of the heating element. The heating element is longitudinally translated within a sleeve having an axis directed toward the substrate carrier. A rotary support carrying the dispenser is rotatable around the sleeve axis to enable the wire outlet orifice to be positioned with respect to the end of the heating element as a function of the relative displacement between the substrate carrier and tool carrier.