发明名称
摘要 PURPOSE:To prevent the top layers from collapsing down despite formation of cracks on target surface and enable even sputtering to be continuously performed by so disposing the targets that their surfaces face diagonally upward. CONSTITUTION:Targets 13, 13' and substrates 14, 14' are provided diagonally parallel and the targets 13, 13' are so disposed that their surfaces face diagonally upward. For example, when the targets 13, 13' are provided with an inclination of 60 deg., cracks stay in their positions and have no worry of collapsing down even when they are formed. Hence, the targets 13, 13' may be used out to the last and uniform sputter films may be deposited on the substrates 14, 14'.
申请公布号 JPS5745466(B2) 申请公布日期 1982.09.28
申请号 JP19780077371 申请日期 1978.06.28
申请人 发明人
分类号 C23C14/34;C23C14/38 主分类号 C23C14/34
代理机构 代理人
主权项
地址