发明名称 |
Method of making FET utilizing shadow masking and diffusion from a doped oxide |
摘要 |
A novel self-align type method of making an FET with a very short gate length and a good high frequency characteristic, and a low noise characteristic, the method comprising the steps of: forming on a silicon epitaxial layer (13) of n-type conductivity a doped oxide film (14) containing boron as an impurity to give p-type conductivity, forming a mask (15a, 16a) containing Si3N4 film and having a width larger than that of a gate region (19) to be formed on said n-type epitaxial layer (13), etching said doped oxide film (14) by utilizing said mask (15a, 16a) as an etching mask to expose surface of said silicon crystal layer (13) in a manner that sides of the part of said doped oxide film (14) covered by said mask (15, 16a) are side-etched by a predetermined width, ion-implanting an impurity of said first conductivity type into said n-type epitaxial layer (13) by utilizing said mask as implanting mask, and carrying out a heat treating thereby diffusing said second conductivity type impurity from said doped oxide film (14) retained only under said mask into said n-type epitaxial layer (13) to form said gate region (19) and driving said ion-implanted first conductivity type impurity into said silicon crystal layer (13) to form a source region (17) and a drain region (18).
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申请公布号 |
US4351099(A) |
申请公布日期 |
1982.09.28 |
申请号 |
US19800149621 |
申请日期 |
1980.05.12 |
申请人 |
MATSUSHITA ELECTRONICS CORPORATION |
发明人 |
TAKAGI, HIROMITSU;UMEBACHI, SHOTARO;KANO, GOTA;TERAMOTO, IWAO |
分类号 |
H01L21/033;H01L21/337;H01L29/80;H01L29/808;(IPC1-7):H01L21/31;H01L21/26;H01L21/22 |
主分类号 |
H01L21/033 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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