发明名称 LEAD FRAME USED FOR SEMICONDUCTOR AND ASSEMBLY AND MANUFACTURE THEREOF
摘要 PURPOSE:To shorten a wire by a method wherein the thickness of the region including the part of tab fringe to lead internal end is reduced, and a tab and lead frame are formed so that the clearance between a tab fringe and lead internal end is more reduced than the thickness of an unreduced region. CONSTITUTION:The center of the lead frame material 9 is pressed to form a thin region 10. The lead 4, frame 5 and dam 6 with the internal ends facing on the tab 2 are formed by precision press. The clearance d between the tab 2 fringe and lead 4 internal end should be the same thickness as the thin region being half of the thickness t of the material 9. Thus, the wire 7 can be shortened in length to realize cost reduction.
申请公布号 JPS57155760(A) 申请公布日期 1982.09.25
申请号 JP19810040327 申请日期 1981.03.23
申请人 HITACHI SEISAKUSHO KK 发明人 SHIMIZU KAZUO;INOUE FUMIHITO
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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