发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent deviation between a package and header to improve moisture resistance, by partly providing projections and grooves on the header and lead part covered with a package. CONSTITUTION:A pellet 2 is fixed on the center of an end of the header 1. Two circular grooves 3 with concentricity are provided on the upper surface of the header 1 so as to surround the pellet 2. The upper and lower surfaces of the header 1 and leads 4-6 covered with the package 8 respectively have the projections 12 which function as dampers encroaching on the part close to the both ends of the package 8. Thus, deviation or crack do not occure between the package and header to improve moisture resistance.
申请公布号 JPS57155757(A) 申请公布日期 1982.09.25
申请号 JP19810040306 申请日期 1981.03.23
申请人 HITACHI SEISAKUSHO KK 发明人 IMAI MICHIYOSHI
分类号 H01L23/48;H01L23/28;H01L23/495 主分类号 H01L23/48
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