| 摘要 |
PURPOSE:To form CVD film of a predetermined thickness uniformly over the full range of the surface of wafer by a method wherein an annular body to insert thereinto a circular-shaped wafer and wafer supporting member projecting toward the inside of the annular body through built-in spring member thereof, is provided. CONSTITUTION:A wafer supporting member 11 in each wafer fixing ring 13 is pressed down into an annular body 10 and a wafer 15 is inserted into the interior 10a thereof. A contact face 11a is pressed to the circumferential side face of the wafer 15 by using a spring member 12 and is held certainly by the inner circumferential face of the annular body 10 and the wafer supporting member 11. Two pieces of wafers 15 are fixed, for example a multiplicity of wafers 15 are mounted on a boat 16 to form CVD film. The boat 16 holds a part of the annular body 10 by a carriage 16a. As a result, the both surfaces of each wafer 15 are completely exposed to the air and the CVD film can be formed over the full region of the surface. |
