| 摘要 |
PURPOSE:To miniaturize and enhance the mounting effect of lead, by forming so that lead enters a protecting groove provided in the half-lower part of a package to prevent the top end from projecting outward from the outer boundary of the package. CONSTITUTION:A plurality of in-line type leads 6 are distributed to the both sides of the package 5 constituted of resin, and the protecting groove 7 is provided from the joint of the lead 6 toward the lower part. The lead 6 is bent down at the position some distant from the bottom of the protecting groove with the top end horizontally extended toward the outside to form a fit connecting part 8 to a printing substrate being not projected toward the outside from the outer boundary of the package. Thus, the outer dimension is reduced with less chance of contacting external force for the improvement of mounting yield. |
