发明名称 WASHING METHOD FOR SEMICONDUCTOR WAFER, MASK, ETC.
摘要 <p>PURPOSE:To wash a material to be washed with high accuracy at low cost, and to improve yield and reliability by injecting liquid spray onto the material to be washed and removing foreign matter on the material to be washed. CONSTITUTION:A pure water supply pipe 14 and a clean air supply pipe 16 are connected to an injection nozzle 12. The nozzle 12 atomizes pure water and clean air supplied from the pipes 14, 16 into minute spray, and sprays them onto the surface of a semiconductor wafer 10. The clean air reinforces the spray and promotes the generation of minute spray of the pure water. Accordingly, foreign matter on the wafer 10 is removed positively, and the surface of the wafer 10 is not damaged also at that time.</p>
申请公布号 JPS57154836(A) 申请公布日期 1982.09.24
申请号 JP19810039421 申请日期 1981.03.20
申请人 HITACHI SEISAKUSHO KK 发明人 TSUBOSAKI KUNIHIRO;IWATA YUTAKA
分类号 B08B3/02;G03F1/00;G03F1/82;H01L21/304 主分类号 B08B3/02
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