| 摘要 |
PURPOSE:To prevent a short-circuit and contact between thick wires for wiring reconstruction use by a method wherein a third pad is provided for connection adjacent pad for external connection use connected to a pad on IC chip. CONSTITUTION:Connections 3, 4 are performed between a pad 1 on IN chip and pad 5 on a package and between a pad 2 and pad 6 respectively. Third pads 21, 22 are provided with a preset distance from the pads 5, 6. when replacing the wiring, initially a X marked pattern is cut to establish the connections 19, 20 between the pads 5, 6 and the pads 21, 22. Since they are arranged close with the others, a thin wire can be used for the connection. Since the position of the pads 21, 22 is spaced selectively from the others with an appropriate distance on the basis of the wires 19, 20, the thick wires for reconstructed wirings use can be connected without causing any trouble. |
