| 摘要 |
PURPOSE:To reduce cost, and to give substrate potential without magnifying the size of a chip by using a CerDip package. CONSTITUTION:Gold paste 22 is applied onto the internal bottom of the main body 21 of a ceramic package called the CerDip package, a semiconductor element 23 is mounted, and an Al electrode 24 is formed. Leads 25 extended to the outside are set up to the upper surface of the side wall of the main body 21, one lead is connected 26 to the electrode 24, and the other lead is connected 26 to a pad on the element. A ceramic cover 27 is fixed to the opening section of the main body 21, and sealed in an airtight manner. According to such constitution, since the electrode 24 is shaped to the pad 22, the element 23 can ge given the substrate potential, and a substrate potential extracting electrode need not be manufactured on the surface of the element 23. Consequently, a process manufacturing the element can be simplified. |
