| 摘要 |
In a method of producing printed circuit boards in which e.g. metallic conductive ways, which if required intersect with interposition of an insulating layer, and contact ways or electrical connecting surfaces, are formed e.g. by printing on a baseplate 1 of insulating material, the baseplate is covered first with a layer 2 of varnish, then the conductive ways 3 are applied to the layer of varnish, then insulating varnish is applied to points of intersection between the conductive ways, then intersecting conductive ways are formed over the insulating varnish, and finally the conductive ways are covered with a layer 4 of varnish which has been made electrically conductive, e.g. by carbon filling. The metallic conductive ways may be replaced by ways of conductive varnish. <IMAGE> |
