发明名称 Metallic solder composite bonding
摘要 A method of bonding a plurality of thermally stable high strength graphite fiber reinforced glass matrix composite pieces is described. The process comprises applying to the surfaces to be bonded at least one layer of a metal which is highly adherent to the composite and the solder and is oxidatively stable. A tie layer may be used between the composite bond surface and the metal layer to better bond the metal layer to the composite. Following application of the metal layer, the composite pieces are stacked with the metal layers facing each other and a solder layer in between. The temperature of the assembly is raised to melt the solder and form the bond. The melting temperature of the solder and the metal layers are chosen so as to be higher than the use temperature of the bonded composite. A bonded composite article thus formed is also described.
申请公布号 US4350744(A) 申请公布日期 1982.09.21
申请号 US19800215283 申请日期 1980.12.12
申请人 UNITED TECHNOLOGIES CORPORATION 发明人 SNITZER, ELIAS;BACON, JAMES F.
分类号 C03C14/00;C03C27/04;C03C27/06;(IPC1-7):C03C27/02;B32B17/06 主分类号 C03C14/00
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