| 发明名称 |
PROVIDING RAISED CONTACT PORTIONS ON CONTACT AREAS OF AN¹ELECTRONIC MICROCIRCUIT |
| 摘要 |
<p>A method of providing a raised contact portion on a contact area of an electronic microcircuit in which a ball is formed at one end of a metal wire by means of thermal energy, the ball is pressed against a contact area of the electronic microcircuit and is connected to said contact area. A weakening is created in the wire near the ball and the wire is then severed at the area of the weakening to provide the desired raised contact portion.</p> |
| 申请公布号 |
IE820631(L) |
申请公布日期 |
1982.09.20 |
| 申请号 |
IE19820000631 |
申请日期 |
1982.03.18 |
| 申请人 |
N.V. PHILIPS GLEOILAMPENFABRIEKEN |
发明人 |
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| 分类号 |
H01H11/06;H01L21/28;H01L21/60;H01L21/603;H01L21/607;H01L23/485;H05K3/24;(IPC1-7):H01L21/44 |
主分类号 |
H01H11/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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