| 摘要 |
PURPOSE:To mount and demount a semiconductor substrate to be treated on a test table safely and surely by a method wherein a mounting and demounting jig provided with a notch or a hole smaller than the outside circumferential diameter of the substrate is made to move upward and downward. CONSTITUTION:When the mounting and demounting jig 3 is made to move to the upward direction A in condition that the semiconductor substrate 1 is put on the mounting part 2a of the test table 2, the substrate 1 on the test table 2 is held with the outside circumferential part thereof by the mounting part 3a of the mounting and demounting jig 3, and is made to secede from the test table 2. The substrate held on the mounting and demounting jig can be put on the test table by the opposite process. At this time, the diameter D1 of notch of the mounting part 3a of the mounting and demounting jig is formed as larger than the outside diameter D2 of the mounting part of the test table. Accordingly the substrate can be mounted on and demounted from the test table safely and surely. |
