| 摘要 |
PURPOSE:To obtain a semiconductor integrated circuit device having small thermal resistance, having connecting area not enlarged, and being enabled to check visually and to perform probing of connecting condition by a method wherein concave connecting terminals are provided at the side of a substrate of the semiconductor integrated circuit. CONSTITUTION:When a chip 2 is to be connected to wirings 6 on the wiring substrate 1 by solder 3, the concave connecting terminals 7 of plural number are formed at the circumference of the side of the chip 2. At first, plural number of chips 2 are formed in an Si wafer 8, then holes 9 to constitute the concave terminals are formed to have the sectional shape shown in the figure, and after then, Al layers 10, Cr-Cu-Cr layers 11 are formed, and moreover Ni layers 12 are formed by plating to obtain the connecting terminals 7. When the chip 2 is connected to wirings 12 at the mounting part of the wiring substrate 1 by melting solder, the chip 2 is adhered closely to the wiring substrate 1 by surface tension of solder to reduce thermal resistance. |
