发明名称 SEMICONDUCTOR SEALING EQUIPMENT
摘要 PURPOSE:To prevent yield of burr on a lead frame, by dividing a spacer block into a plurality of pieces in the horizontal direction, thereby suppressing the amount of thermal deformation of the spacer block, and uniformly performing clamping. CONSTITUTION:A spacer block 20 supporting a surface plate 1 is constituted by many divided block pieces 20a. Since the surface plate is heated with heaters 7 in the surface plate 1 to a high temperature, a large difference in temperature is generated between the upper and lower surface sides of the spacer block 20. Since the spacer block 20 is divided into many block pieces 20a, the amount of thermal deformation of each block piece 20a is very small. Meanwhile, the surface plate 1 is supported by the block pieces 20a. Thus clamping can be performed uniformly, and yield of burr on a frame can be prevented.
申请公布号 JPS63119539(A) 申请公布日期 1988.05.24
申请号 JP19860266221 申请日期 1986.11.08
申请人 MITSUBISHI ELECTRIC CORP 发明人 TSUTSUMI KOJI
分类号 B29C45/02;B29C45/14;B29C45/26;B29L31/34;H01L21/56 主分类号 B29C45/02
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