发明名称 METAL MOLD DEVICE
摘要 PURPOSE:To enhance cooling efficiency and capability of a metal mold device by a method wherein a thermoelectric element is placed in a mold near a molding surface, and they are brought into close contact with the mold while directing heat-absorbing surfaces of the elements toward the molding surface side so as to cool heat-radiating surfaces. CONSTITUTION:When producing a molded article S while cooling strongly a part in the vicinity of a sprue 8, the thermoelectric element 5 is provided between the main body of the fixed-side mold 1b and a nozzle support 7 while directing the heat-absorbing surfaces of the element 5 toward the molding surface side of the mold 1, utilizing the support 7. The heat-radiating surfaces of the elements 5 are cooled by cooling water passed through holes 3 for cooling. When the molded article S part is to be cooled strongly, the elements 5 are provided between a molding surface part of the movable-side metal mold 1a facing against the sprue 8 and a cooling insert 2, with the heat-absorbing surfaces of the elements 5 faced to the molding surface of the mold 1a, and the heat-radiating surfaces 5 is cooled by cooling water passing through the hole 3. In addition, water is also passed through grooves 4 for cooling so as to cool the mold 1b as in a conventional case.
申请公布号 JPS57151307(A) 申请公布日期 1982.09.18
申请号 JP19810038332 申请日期 1981.03.17
申请人 YAZAKI KAKOU KK 发明人 AKIYAMA TOSHIO
分类号 B29C45/00;B29B13/00;B29C33/00;B29C33/02;B29C33/04;B29C33/38;B29C37/00;B29C41/00;B29C45/26;B29C45/73;B29C45/78 主分类号 B29C45/00
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