发明名称 ULTRASONIC WAVE OR HIGH FREQUENCY WAVE ADHERING SYSTEM
摘要 PURPOSE:To simplify adhesion and combine with waterproofness of an adhered part, by making an resin film an inside face at the mouth of a paper bag etc. of which one side of paper is laminated with the resin film and adhering mouth by the ultrasonic wave or high frequency wave. CONSTITUTION:A resin film 2 is laminated to one face of paper and adhesion is performed between the resin film 2 laminated to the inner face of the paper by exerting the ultrasonic wave or the high frequency wave on the mouth 3 of the bag in adhering. Because the resin film 2 is laminated to the adhering face in such a way, adhesion is easy and at the same time the adhering method of the paper bag etc. combining with waterproofness of the adhered part can be obtained.
申请公布号 JPS57150528(A) 申请公布日期 1982.09.17
申请号 JP19810034646 申请日期 1981.03.12
申请人 KAWASHIMA KAGAKU KK 发明人 KAWASHIMA EISUKE
分类号 B29C53/00;B29C65/00;B29C65/02;B29C65/04;B29C65/08 主分类号 B29C53/00
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