发明名称 PARTIAL PLATING METHOD FOR LEAD FRAME
摘要 PURPOSE:To eliminate the waste of an expensive plating material by covering a plating tank incorporating a plating liquid injection nozzle with a supporting base with an opening section and disposing the lead frame onto the supporting base through a mask plate shielding a section not plated when the lead frame is plated partially. CONSTITUTION:The plating liquid injection nozzle 22 is mounted to the bottom of the plating tank 21, a pump 23 is connected to an end section positioned outside the tank, and the pump is connected to a recovery tank 29 recovering a plating liquid from the bottom of the tank 21. The supporting base 25 to which the opening section 24 is formed is covered where opposed to the nozzle 22 on the tank 21, the mask plate 27 with a mask section 30 having an inverted triangular section stopping the plating liquid to an element mounting section as the region not plated is arranged onto the supporting base, and the plating liquid injected to the mask section 30 is dropped into the tank 21. A plating device 31 is formed in this manner, the frame 11 is positioned onto the mask plate 27, and held down by a hold-down plate 26, and a power supply 28 is connected to the frame 11 and the nozzle 22.
申请公布号 JPS57149756(A) 申请公布日期 1982.09.16
申请号 JP19810034854 申请日期 1981.03.11
申请人 TOKYO SHIBAURA DENKI KK 发明人 TSURUSHIMA KUNIAKI
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
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