发明名称 TREATING DEVICE FOR SUBSTRATE
摘要 PURPOSE:To increase a space factor while improving working property by forming a film forming device to the substrate through the combination of the rotary motion of a plane besides movement on a belt and delivering the substrate among these parts through the vertical motion of a seat on which the substrate is loaded. CONSTITUTION:The substrate treating device is formed by a substrate charging chamber 1, a pre-treatment chamber 2, a treatment chamber 3 and a substrate extracting chamber 4, sealing valves 7, 10, 12 are each mounted to these connecting sections, and the insides of the chambers 2, 3 are brought to vacuum conditions by means of a vacuum pump separately set up during treatment. The device is formed in this manner, a cassette 6 housing a plurality of the substrates 5 to be treated is admitted into the chamber 1, the substrates 5 are sent into the chamber 2 incorporating an etching electrode 8, a heating jig 9, a rotary arm 19 and an oscillating conveyor belt 20 by means of the conveyor belt 14 at every one sheet, and necessary etching, etc. are conducted. The substrates 5 are transported onto the conveyor belt 16 of the next chamber 3 by means of an oscillating conveyor belt 20', films are formed by means of the film forming device 11 here, and the substrates are received into a cassette 13 in the next chamber 4 by using the conveyor belt 17.
申请公布号 JPS57149748(A) 申请公布日期 1982.09.16
申请号 JP19810035743 申请日期 1981.03.12
申请人 NICHIDEN VARIAN KK 发明人 TAKAHASHI NOBUYUKI
分类号 H01L21/677;C23C14/56;C30B33/00;H01L21/205;H01L21/302;H01L21/3065;H01L21/67 主分类号 H01L21/677
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