| 摘要 |
PURPOSE:To increase the strength of a die, to facilitate manufacture and to miniaturize a lead frame by regulating the shape of a guide formed to the side surface of a resin sealing body by the connector of the lead frame. CONSTITUTION:The connectors 22 are formed at both sides of leads 21 connected to a supporting frame 20 while their width Y1 is equalized with the collar- shaped guide 27 at both sides of the resin sealing body 25 with width X1. The lead frame is disposed into the hollow section 26 of the die 24. The hollow section 26 is wider than the width Y1 of the connectors 22, the projecting surface 27a of the guide 27 formed to the side surface of the sealing body 25 is regulated by hold-down tools 24al, 24bl projected to the inside and the surfaces 22a of the connectors 22, and the shape of the outer surface of the sealing body is regulated by the inner wall surface of the hollow section 26 shaped by the die 24. A semicondctor element mounted at the noses of the leads 21 and one parts of the leads 21 are sealed through the injection of resin, the leads 21 are cut at predetermined positions, and the guide 27 and the connectors 22 are separated. According to this manufacture, upper and lower dies are easily manufactured more than conventional methods, the lead frame can be miniaturized, and the leads can be sealed with high accuracy for a long term. |
