发明名称 |
METHOD OF MOUNTING ELECTRONIC COMPONENT |
摘要 |
Electronic components are adhesively held by a flexible, expansible and contractible adhesive sheet, and pressing pins pressing one of the electronic component on a position to be mounted on a printed circuit substrate with penetrating the adhesive sheet. Then, electronic component is separated from the adhesive sheet by bringing up the adhesive sheet and at that time the electronic component is fixed on the printed circuit substrate by the pressing pins. |
申请公布号 |
JPS63129696(A) |
申请公布日期 |
1988.06.02 |
申请号 |
JP19860277252 |
申请日期 |
1986.11.20 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KABESHITA AKIRA;HAMANE TOKUHITO;TANAKA KURAHEI |
分类号 |
H05K3/30;B23P21/00;H05K3/34;H05K13/04 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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