| 摘要 |
PURPOSE:To obtain a silver solder material with the surface smoothed, by causing the silver solder material to include prescribed quantities of Ag, Cu, and Mn or Ni and a prescribed quantity of one or more out of Pd, In, Sn, etc. CONSTITUTION:A silver solder material consists of 50-95% Ag, 5-50% Cu, 0.005-1% Mn or Ni, and 0.005-5% one or more out of Pd, In, Sn, Li, Sb, and Ge. This solder material is finished to a smooth surface and is used in vacuum or an atmosphere. |
