| 摘要 |
Disclosed is an improved process for preparing metal plated thermoplastic compositions by electroless metal deposition and subsequent electrolytic plating. This process comprises the sequence of etching a filled thermoplastic resin substrate with dilute acid solution, treating with a sensitizer such as a tin salt, activating with a noble metal salt solution, electroless metal deposition using an electroless copper or nickel plating solution, and electrolytic plating with a metal selected from the group consisting of copper, nickel, chromium, or combinations thereof. The improvement is in the use of a wollastonite filler having an average particle size of less than about 3.5 microns, wherein 95 numerical percent of the particles are smaller than 10 microns in the longest dimension. The resulting electroplated articles exhibit a mirror-like finish and a peel strength of at least about 3 lbs./in. Also disclosed is a nylon-6 plating composition useful in the process containing the above-described wollastonite filler and an organosilane coupling agent.
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