| 摘要 |
PURPOSE:To make unnecessary a separate resin sealing frame and to reduce cost for a mounting structure by a method wherein a copper foil is laminated on an insulated substrate supplied with a device hole and a finger is formed in the etched copper foil, and simultaneously a resin frame with a resin injecting port is formed with a copper foil. CONSTITUTION:After a device hole (a) is formed in a polyimid insulative substrate 1, a copper foil is laminated on the substrate and the copper foil is etched to provide a finger 2, a resin sealing frame 5 and a resin injecting port 7 simultaneously through the photoetching method. Subsequently , the substrate is plated with tin or gold and a projected electrode (d) of an IC element 4 as well as the finger 2 are heat-bonded onto the substrate. Then sealing resin is injected from the port 7. In so doing, because the sealing frame 5 is formed with the copper foil, the height of the sealing resin becomes the same as that of the substrate 1. If the sealing frame 5 is connected to the circuit board 10 for earthing, the element 4 is prevented from being damaged by static electricity. |
