| 摘要 |
PURPOSE:To dry an IC in a short time by heating it with a heater block after placing the IC via an adhesive on a lead frame. CONSTITUTION:A lead frame 8 having a tab lowering unit 6 is guided via guide rails 12. A heater block 13 is cooperated with a conveyance lever 11, is raised when not conveying and is contacted with the unit 6. An IC 10 is placed via an adhesive 9 on the unit 6, and is heated and dried by the block 13. The adhesive can be dried in a short time in good transfer efficiency by employing the block 13. |
