| 摘要 |
PURPOSE:To enhance the sealing accuracy of a semiconductor device by interposing an external lead of a lead frame and fine strips between upper and lower dies and floating a substrate support in the cavity of the mold, thereby sealing resin. CONSTITUTION:Two fine strips 15, 16 extend from the side opposite to the side connected to the external lead 6 of a substrate support 2 at a lead frame in a structure that the strips are connected to a second common fine strip 17. A transistor assembly structure formed with the lead frame is interposed between dies 13 and 14, and resin 30 is filled in the cavity of the mold and is molded. In this case, the external lead 6 of the lead frame is interposed between the upper and lower dies at one side, and is interposed between the upper and lower dies at the fine strips 15, 16 and the second common fine strip 17. The projections of the mold are engaged with holes 8, 18 formed at the first and second common connecting strips 9, 17. |
