发明名称 TARGET FOR SPUTTERING
摘要 PURPOSE:To obtain a target for sputtering wherein a thin film having high quality and high reliability can be formed at low cost with a simple constitution by providing a target main body having metal or nonmetal as an essential component and furthermore providing a plurality of ring-like structural materials having same component as the above-mentioned component to the target main body. CONSTITUTION:A metallic target 2, for example made of Te is bonded on a backing plate 1 made of copper or stainless steel with a bonding layer 3 consisting of alloy chiefly made of In. In such a metallic target 4, a plurality of ring-like structural materials which consist of metal different from Te i.e. consist of single substance of Pd, namely multiple rings A (5a), B (5b) are buried so that these are made coaxial with the center of the metallic target main body 2. By this target for sputtering, the film composition of a thin alloy film is uniformly formed on a base plate with a simple constitution and also the film having high quality and high reliability can be formed.
申请公布号 JPS63128171(A) 申请公布日期 1988.05.31
申请号 JP19860273287 申请日期 1986.11.17
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MATSUBARA KUNIHIRO;OTA TAKEO;INOUE ISAMU;YOSHIOKA KAZUMI
分类号 C23C14/34;G11B7/26;G11B11/10;G11B11/105 主分类号 C23C14/34
代理机构 代理人
主权项
地址