| 摘要 |
PURPOSE:To enable the mounting of a supermultipin IC chip not available by wire bonding by the use of a transparent insulating substrate treated with patterning of metal thin film in place of bonding wire. CONSTITUTION:A fine pattern 8 with the same accuracy as an IC chip, and an external electrode 9 and internal electrode 10 are formed on a transparent bonding substrate 7. Next, after SiO2 11 is adhered, electrodes 9, 10 are exposed, and then the electrodes 9, 10 are plated with metal having low melting point. Subsequently, a package 14 is provided which has an opening through the front to back of a ceramic substrate. First the IC chip 2 is adhered to a heat sink 13 via Au-Si alloy 16 with the IC chip overhead. Next, the electrode 4 of the chip 2 and electrodes 9, 10 are positioned by means of the transparency of the substrate 7 with the pattern 8 downward. Au-Sn alloy 18 is generated from Au of a chip electrode and Sn of the substrate 7 to complete the bonding. Thus, supermultipin IC chip can be packaged. |
