| 摘要 |
PURPOSE:To allow the retention of a main surface directly by a pincette without the occurrence of scratches, by forming a thick film on a rough entire surface on a wafer without bonding pads and dicing lines by a printing technique. CONSTITUTION:A field oxide film 102 is formed on the surface of wafer 101 formed with elements and, after an Al wiring having the bonding pad 103 is formed on this film 102, a PSG film 104 is heaped. Successively, the bonding pad 103 is exposed in the most part, and simultaneously the dicing line 105 is formed. Next an epoxy resin thick film 106 is formed on the most part of the film 104 without the bonding pad 103 and line 105 of the wafer 101 by a printing technique. Thus, the film 104 or Al wiring produces no breaks. Therefore, the retention of the main surface of a chip by a vacuum pincette can remarkably improve the workability. |
