| 摘要 |
PURPOSE:To obtain the device of high reliability by sealing a semiconductor element with the first insulating material and by coating the periphery thereof with the second insulating material or impregnating with the third insulating material a part wherein the first insulating material is sparse. CONSTITUTION:The semiconductor element 3 is fixed at a prescribed part 2 of a lead frame, connection 4 is conducted, and sealing is made with resin 5. Then, coating is made with the second insulating material 6 to protect the sealed resin 5. Or, after the connection 4 is conducted, the element 3 is sealed with the insulating material 5 and the insulating material 5 is impregnated with the third insulating material 9, whereby a part wherein the material 5 is sparse is made tight. This constitution prevents the permeation of water from outside even when the device is small and thin, and thus the device of high reliability can be obtained. |
