| 摘要 |
PURPOSE:To intend the full automation of ultrasonic wire bonding process, by enabling the automatic supply, set and carrying-out of semiconductor parts. CONSTITUTION:A semiconductor part 8 successively fed out from a semiconductor part feed gear 18 is intermittently sent along a straight supply guide line 14 to transfer on a straight transport guide line 10 installed on a working table 6 and stops at the fixed position of the table 6. Hereupon the part 8 is set to be treated with required bonding by a bonding tool 2. After bonding is finished, the part is set again along the guide line 10 to transfer on a straight carrying- out guide line 16 and is contained into a semiconductor part container 20. This system allows the automatic supply, set and carrying-out of semiconductor parts in an ultrasonic wire bonding device. |
