| 摘要 |
PURPOSE:To prevent the scattering of impurities when glass for hermetic sealing is melted by heating, by isolating the surface of the semiconductor device packed inside from the galss. CONSTITUTION:The projected parts (ceramic) 11a and 12a of a container 11 and a cover 12 are provided between the sealed parts 14 and 17 of a package and an IC chip 13, preventing the melted surface of glass from facing the suraface of the IC chip 13 directly. Accordingly, when the glass is melted by heating for sealing, no unnecessary impurities stick to the surface of the chip. In addition, since the melted surface of the glass is small, the slippage of lead frames 15, 16 ... are also reduced. |
