发明名称 |
Method for making custom integrated circuits and metallization artwork therefor |
摘要 |
Integrated circuit semiconductor wafers are prepared through diffusions, depositing a protective glass layer, opening holes in the glass layer exposing component contact areas. The wafers are stored. Partially complete metallization artwork is prepared by using the normal cut-and-strip technique, whereby the interconnections between component elements are essentially unaccounted for in this artwork. A circuit design engineer completes the artwork by using opaque adhesive tape to represent the interconnections of his circuits. Besides providing practical means by which such designers may fully participate in deciding upon layout and circuit realization tradeoffs with the IC manufacturer, this invention provides a shorter faster process at lower cost than by conventional procedures.
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申请公布号 |
US4348451(A) |
申请公布日期 |
1982.09.07 |
申请号 |
US19810261066 |
申请日期 |
1981.05.06 |
申请人 |
SPRAGUE ELECTRIC COMPANY |
发明人 |
GONTOWSKI, JR., WALTER S. |
分类号 |
H01L23/525;H01L23/528;H05K3/00;H05K3/14;(IPC1-7):B32B3/00;B05D5/12;B32B15/04;H01L27/02 |
主分类号 |
H01L23/525 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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