发明名称
摘要 PURPOSE:To obtain an ohmic electrode featuring large adhesive force and low electric resistance by evaporating Au - Zn film on P-type chemical semiconductor containing P as one of the primary components and then attaching the electrode composed of Cr, Ti, Mo and the like via the Au - Zn film.
申请公布号 JPS5742214(B2) 申请公布日期 1982.09.07
申请号 JP19770108778 申请日期 1977.09.12
申请人 发明人
分类号 H01L21/28;H01L29/43;H01L33/30;H01L33/36 主分类号 H01L21/28
代理机构 代理人
主权项
地址