| 摘要 |
<p>PURPOSE:To take more chips out of a wafer of an identical area and improve the yield by a method wherein hexagonal chips are formed on the wafer and are cut out. CONSTITUTION:A disc wafer 2 is sliced out of a cylindrical semiconductor single crystal substance 1. The wafer is divided into hexagonal semiconductor chips 3 in which integrated circuits or like are composed. The impurity density in the circumference area of the substance 1 is differnt from that in the inner area, but the chips obtained by dividing the wafer into hexagons can be arranged in the circumference area at the relatively uniform intervals, so that the deviation of the impurity density for respective chips can be avoided. And, for instance, 153 hexagonal chips can be cut out of a three-inch wafer, while 150 square chips can be cut out of the same wafer.</p> |
