Bonding inorganic granules,申请号US19560576234-传众专利搜索

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法人/股东/高管

发明名称	Bonding inorganic granules
摘要
申请公布号	US2878539(A)	申请公布日期	1959.03.24
申请号	US19560576234	申请日期	1956.04.05
申请人	THE BORDEN COMPANY	发明人	HALPERN BENJAMIN D.;HOYT HOWARD E.
分类号	B22C1/22	主分类号	B22C1/22
代理机构		代理人
主权项
地址

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