Housing for electronic devices - comprises base and hood, sealed at periphery contg. liquid which evaporates to dissipate heat via hood

摘要

Housing for enclosing a power electronic device consists of a base (4) onto which is fastened at least 1 power semiconductor device (1) and a hood (9), fastened together around their periphery (11) to form a sealed enclosure inclosing the electronic device. Specifically, the housing contains a heat conducting liq. (10) which partly fills the housing, in direct contact with the electronic device, so that the calories released by the device during operation are removed via the liq. through the hood of the housing, onto which the vapours from the liq. condense after evapn. The dissipation of heat from the device is more efficient than in prior art.