| 摘要 |
<p>A wafer workpiece polishing temperature control method and apparatus are provided wherein wafers are mounted upon a rotatable pressure plate assembly positioned in rotatable contact with a turntable assembly supported polishing pad, the turntable assembly having internal fluid cooling means, the wafer polishing temperature control being achieved through responsive closed loop electromechanical means activated by variation of polishing pressure upon the wafers and the polishing pad.</p> |
