| 摘要 |
PURPOSE:To cut down the cost of production as well as to contrive mass production of semiconductor device in film-carrier system by a method wherein a film substrate is formed by bonding two sheets of copper foils using resin, and an element adhering section, an electrode lead and a supporting pattern are provided by performing an etching on the copper foils and an element is then assembled. CONSTITUTION:The copper foils 11 and 12 are pressure-bonded and hardened using an epoxy bonding agent 13, cut into narrow-strip pieces, an index hole 14 is punched, and a film substrate 10 is formed. Then, a plurality of electrode leads 17, an element adhering section 16 and narrow-stripped patterns 18 and 19 to be used for protection are formed on one of the copper foils by performing an etching, and a supporting pattern 20 and a reinforcement patterns 21 and 22 are provided on the other copper foil. Then, an element 23 is adhered and a wire-bonding is performed, a probe inspection is performed as occasion demands, and after the above has been sealed using resin 24, the narrow-stripped section is removed by cutting. A lead reinforcement section 22 and a lead 17 are connected by providing a through hole 25 wherein solder 26 is filled in, and the reinforcement section 22 is used for the soldering of the printed substrate and the like. Accordingly, the mass production and the low production cost can be accomplished. |
