| 摘要 |
A method and apparatus for selectively plating a material using an elastic mask plate having an opening of a shape defining a portion of the material to be plated provided on an outer case. The upper lid of the outer case has a through-hole of a shape substantially equal to that of at least one portion to be plated. The material to be plated is held between the elastic mask plate and an elastic pressing plate which is capable of pressing the material to be plated into contact with the elastic mask plate. A plating solution is jetted onto the exposed portion of the material to be plated through a plating solution jetting port of a nonelectro-conductive nozzle plate in the upper portion of an inner case located within the outer case. The plating solution jetting port of the nozzle plate is of a desired shape and in a position corresponding to the portion of the material to be plated. A soluble anode of the plating element is also located within the inner case and a plating solution feeding tube having small orifices for jetting the plating solution projects into the inner case. The feeding tube jets the plating solution onto the material to be plated by uniformly jetting the plating solution through the small orifices toward the soluble anode. By the use of the above-described method for selectively plating a material, the feeding of a metallic salt is not required during the plating, undesirable oxidizing reactions will not occur on the anode surface, and a nozzle plate corresponding to the portion of the material to be plated can be easily and inexpensively fabricated. |
