| 摘要 |
<p>A face bonding type chip-shaped solid electrolytic condenser molded in insulating resin (17). A cathode terminal (15) connected to the cathode layer of a condenser element (12) is provided with a U-shaped fixed section (15b), a neck (15c) narrower than the fixed section (15b), a vertical section (15d) including first and second bends (15e, 15f) and an external connecting section (15a). The U-shaped fixed section (15b) of the cathode terminal (15) is soldered to the cathode layer of the condenser element (12), thereby absorbing the mechanical stress applied the condenser element (12) at the time of sheathing by the vertical section (15d), and thereby eliminating the application of the stress to the condenser element (12).</p> |
