| 摘要 |
<p>PURPOSE:To automatically inspect a non-adhesion flaw, by providing a flaw inspection quality judge part, a flaw inspection region setting part and a flaw detection part. CONSTITUTION:The infrared rays 5 transmitted through an adhered wafer 1 are allowed to irradiate the image pickup surface of the infrared vidicon of a photoelectric converting part 6 to be photoelectrically converted and inputted as a quantized image to be stored in an image memory part 9. This image data is successively taken in a flaw detection part 16 on the basis of the order from a control part 10 and the detection processing of the non-adhesion flaw of the wafer I in a region to be inspected is performed. The non-adhesion flaw detected by the flaw detection part 16 is sent to a flaw inspection quality judge part 12. The shape dimension reference value Br of the non-adhesion flaw is preset to a flaw shape setting part 13. The flaw inspection setting region phii of the wafer I is set by a flaw inspection region setting part 15 to be taken in the judge part 12 along with the reference value Br and used as an inspection condition extracting a normal non-adhesion flaw. By this method, the non- adhesion flaw can be automatically inspected.</p> |
