Apparatus for mounting electronic components

摘要

An apparatus for mounting electronic components on a printed board substrate comprises a component feeder for sequentially feeding the electronic components in an aligned row, a chuck which receives and rectifies by pinching the position of the electronic components, a vertically movable mounting head, which holds by air suction one of the electronic components preliminarily pinched and rectified of the position by the chuck, and goes down through a wide open gap of the chuck to mount the electronic component on an accurate position of the substrate.