发明名称 FORMING METHOD FOR PATTERN BY ELECTRON BEAM
摘要 PURPOSE:To obtain a new method of forming a high sensitivity pattern without detrimental liquid waste by combining a patterning of silver halide film by the exposure of an electron beam and a patterning of metal by electroless plating. CONSTITUTION:This method has the steps of forming a silver halide film on a substrate, exposing it with an electron beam, X-ray or ion beam to form a pattern of silver particles, and forming a metallic film by electroless plating. High resolution silver halide emulsion is coated on a glass substrate 1 to form a silver halide layer 2, a pattern is drawn by an electron beam drawing device, is then developed and fixed to form a silver particle pattern. Then, the substrate is dipped in an electroless nickel plating bath to form a nickel film 4, and is then cleaned and baked, thereby obtaining a desired mask.
申请公布号 JPS57139923(A) 申请公布日期 1982.08.30
申请号 JP19810023683 申请日期 1981.02.21
申请人 TOKYO SHIBAURA DENKI KK 发明人 TSURUSHIMA TOSHIAKI
分类号 H01L21/027 主分类号 H01L21/027
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