发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To improve the adhesive strength of a pellet, and to reduce cost by using polyimide resin, into which the metallic powder of Al, etc. is mixed, as paste fast sticking the pellet onto a base. CONSTITUTION:A pellet sticking section 3 is metallized and formed to the inner bottom of the base 1 of a package consisting of a substance such as ceramics, and the Si pellet 2 to which an element is shaped is fast stuck by using the paste 5. A connecting process with a lead by wires 7 and an airtight sealing process through the glass welding of a cap are conducted after the pellet is fast stuck. A material obtained by mixing the Al powder to the polyimide resin, heatproof temperature thereof is higher than glass sealing temperature, is used as the paste 1, and an Al layer is preferably formed previously onto the back of the pellet 2. Accordingly, the device resists the high temperature of a post process and the adhesive strength can be kept while cost can be reduced because the precious metals are not employed.</p>
申请公布号 JPS57138145(A) 申请公布日期 1982.08.26
申请号 JP19810023114 申请日期 1981.02.20
申请人 HITACHI SEISAKUSHO KK;NITSUKAN DENSHI KK;HITACHI MAIKURO COMPUTER ENGINEERING KK 发明人 USAMI TAMOTSU;OOTSUKA KANJI;ARAKI TAKASHI;TSUKITA MUTSUO;TSUBOI TOSHIHIRO;SUGIMOTO SHIYUUICHI;MIWA TAKASHI
分类号 H01L21/52;H01L21/58;(IPC1-7):01L21/58 主分类号 H01L21/52
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