发明名称 DETECTION OF BREAKING OF WIRE IN WIRE BONDING DEVICE
摘要 PURPOSE:To detect whether the bonding is performed satisfactorily or not on both electrode side and lead side as well as to detect the breaking of wire without making an erroneous decision by method wherein a capillary is raised after the bonding work has been performed, and a continuity test is performed on the material to be bonded and the wire. CONSTITUTION:Between a spool 3, which feeds the wire 4, and a lead frame 1, a continuity detecting section 7 consisting of, for example, a power source 8, a resistor 9 and a detector 10 is connected when a test is performed. The test is performed at the stage wherein a bonding work has been performed on the electrode 2a on a pellet 2 and the capillary 5 has been pulled up. When a transistor and the like are being formed on the pellet, the polarity of the electrode is set in the forward direction. Then, the test is performed before the bonding on a lead 1b is ended, the capillary 4 is pulled up and the wire 4 is cut off by the working of a clamper 6. Accordingly, whether the bonding has been performed on the electrode 2a and the lead 1b satisfactorily or not can be detected, and the breaking of wire can also be detected.
申请公布号 JPS57138150(A) 申请公布日期 1982.08.26
申请号 JP19810024456 申请日期 1981.02.20
申请人 SHIN NIPPON DENKI KK 发明人 HOSOMI YUTAKA
分类号 H01L21/66;H01L21/60 主分类号 H01L21/66
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