发明名称 WIRE BONDING METHOD FOR INTEGRATED CIRCUIT
摘要 PURPOSE:To eliminate the need for adjusting a focus in an automatic device by adjusting the focus to either or the middle of a pellet having difference in stages and a lead in the same optical system, imaging both positioning marks, changing an indistinct image into binary system and detecting the position. CONSTITUTION:A camera such as a TV camera 1 with the optical system 2 is driven in the X and Y directions, and matching marks formed to the leads 7 of a package 3 and the pellet 6 are imaged. The signals are picture-processed, the positions of the marks are detected, a stage 5 is driven by a controller 10, and automatic bonding is conducted. The picture processor 4 is given a function which changes the signals into binary system and processes them, and the position of the focus at the time of imaging is used as the position of the focus of parts such as the leads 7. In this case, an obscure image is obtained due to difference in stages at the pellet side, but the locations of the marks can be detected at accuracy within the allowable range of bonding by setting the image at a proper level and changing the picture signals into binary. Accordingly, automatic bonding is enabled without forming a focus adjusting function to the the optical system because the information of a reference position is acquired.
申请公布号 JPS57138148(A) 申请公布日期 1982.08.26
申请号 JP19810022916 申请日期 1981.02.20
申请人 HITACHI SEISAKUSHO KK 发明人 ARIGA MAKOTO
分类号 H01L21/60 主分类号 H01L21/60
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