| 摘要 |
PURPOSE:To obtain bright plating having no partial clouding or irregulaties on copper (alloy) by chemically polishing the copper (alloy) with chemical polishing liquid contg. azoles then carrying out bright Ni plating thereon. CONSTITUTION:The above-described chemical polishing liquid is formulated to be present with at least 1 kind of >=10ppm azoles expressed by the formula, more particularly about 100-1,000ppm. Aqueous mixed liquids contg., for example, sulfuric acid, nitric acid and hydrochloric acid are used as the chemical polishing liquid. Thence, copper or copper alloy is chemically polished with the chemical polishing liquid present with the azoles, after which it is subjected to bright Ni plating by adapting a method used heretofore, for example, an electroplating method using a watts bath or th like. Here, for example, imidazole, pyrazole, benzoimidazole, indazole, benzotriazole, etc. are used as the azoles of the formula. |
