发明名称 |
HEAT SINK MOUNTING |
摘要 |
<p>HEAT SINK MOUNTING Disclosed are methods and apparatus for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end. The longer shank is threaded and at least the shorter shank or head stud is tin-plated. The stud may be swaged into a mounting hole in the heat sink and the heat sink and semiconductor case pre-assembled. The pre-assembled unit may then be mounted and soldered to the circuit board along with other circuit components.</p> |
申请公布号 |
CA1130466(A) |
申请公布日期 |
1982.08.24 |
申请号 |
CA19800343286 |
申请日期 |
1980.01.07 |
申请人 |
THERMALLOY INCORPORATED |
发明人 |
JORDAN, WILLIAM D.;HUNDT, ROGER C.;PRITCHETT, JAMES D. |
分类号 |
H01L23/40;H05K1/02;H05K3/30;H05K7/20;(IPC1-7):05K1/18 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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